The LED downlight manufacturer tells you that the initial form of LEDs entering the lighting field is lamp beads, which are directly soldered on the board, first 3528, 5050, and later 3014, 2835. However, the disadvantages of this method are that there are many processes, LED packaging is also SMT, the cost is high, and there are more problems such as heat transfer. So COB was introduced into the LED field at this time.

The LED downlight manufacturer tells you that the traditional LED is "LED light source discrete device → MCPCB light source module → LED lamp", mainly because there is no ready-made suitable core light source components, which is not only labor-consuming and time-consuming, but also high cost.
The LED downlight manufacturer tells you that using COB package "COB light source module → LED lamp", multiple chips can be directly packaged on the metal-based printed circuit board MCPCB, and the heat is directly dissipated through the substrate, saving the cost of one-time packaging of LED, light engine module Production cost and secondary light distribution cost. In terms of performance, through reasonable design and micro-lens molding, the COB light source module can effectively avoid the drawbacks such as point light and glare existing in the combination of discrete light source devices; it can also be added by adding an appropriate red chip combination. On the premise of life, it can effectively improve the color rendering of the light source.
The LED downlight manufacturer tells you that COB packaging is chip On board, which is to adhere the bare chip to the interconnect substrate with conductive or non-conductive glue, and then wire bond to achieve its electrical connection (flip chip method does not require wire bonding) , that is, LED chip and substrate integration technology.
The above information is the LED downlight manufacturer's introduction and analysis of the COB compared to traditional LED SMD, hope it helps you.